1. Gold-tin alloy (Au80Sn20): the ultimate solution in the field of high reliability. As the "king of performance" in the ...

So, you’re trying to get a handle on chip BGA technology? It’s pretty much everywhere in our gadgets these days, from phones to more serious equipment. Basically, it’s a way to pack a lot of ...

ROLLING MEADOWS, IL – BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly ...

The “reverse hybrid” assembly process involves using SAC (Sn-Ag-Cu) solder paste in conjunction with BGA components that feature low-temperature solder (LTS) balls. The soldering is performed using a ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...

2.5D package realizes the interconnection of multiple dies through Si interposers, which can greatly improve the data transmission rate between dies. However, its multi-layer structure and high ...

Abstract: A three-dimensional finite element analysis model of BGA components was established. Using ANSYS, this model was subjected to stress-strain finite element simulation analysis under ...

Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed ...

Shenmao Technology is pleased to introduce SMF-WC58, a water-soluble, halogen-free tacky flux developed for ultra-fine bump pitch flip-chip and BGA/CSP attach processes. ... SHENMAO Technology. Inc.