Korea JoongAng Daily on MSN
LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
The Chosun Ilbo on MSN
LG Innotek’s smart IC substrate halves carbon emissions, boosts durability
LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
THIRUVANANTHAPURAM: As part of initiatives to achieve self reliance in the semiconductor sector, two application-specific integrated circuit (IC) chips designed ...
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